Friday, September 24

Tag: dw

EVG, hetero-integrated Die-to-Wafer hybrid junction achieves placement accuracy of 2 μm or less

EVG, hetero-integrated Die-to-Wafer hybr ...

News
Austrian EV Group (EVG), a manufacturer of wafer bonding and lithography equipment for MEMS / semiconductor device manufacturing, has adopted Die-to-Wafer (D2W) hybrid batch bonding technology using existing wafer bonding technology and processes and bonding layer materials. Announced that it has de... ...